Cutting-edge information about materials, technologies, and mechanisms of printed electronics, and their applications for the smart packaging

Printed Electronics for Smart Packaging describes how and why to use printed electronic devices for application in smart packaging.

Written by a highly qualified academic, Printed Electronics for Smart Packaging covers sample topics such as:

• Applications of printed electronics, such as flexible screens, intelligent labels and packaging, interactive books and posters, and even upholstery
• Mechanisms of smart packaging, printing methods and integrated strategies, and functional inks and substrates for smart packaging
• Printed tracks for smart tags and IPES, printed optoelectronic devices and energy suppliers for smart packaging, and printed sensors and indicators
• Integrated printed electronics systems, and expert outlooks and perspectives on potential future directions for research and development in the field

A must-have resource for anyone to expand the knowledge of the latest developments for intelligent packaging, Printed Electronics for Smart Packaging is an essential read for not just related academics but also various intersecting industries and professionals due to the importance of packaging in all market sectors.

Autorentext

Wei Wu is full professor of School of Physics and Technology, Wuhan University. He received the State Scientific Innovation and Pioneer Award in 2023, the 15th Bi Sheng Award of Printing Technology in 2019, the STAM Best Paper Award in 2017, and the Hong Kong Scholars Award in 2014.

Inhalt
Chapter 1 Introduction of Printed Electronics and Smart Packaging
Chapter 2 Mechanisms and Strategies of Smart Packaging
Chapter 3 Printing Methods and Integrated Strategies
Chapter 4 Functional Inks and Substrates for Smart Packaging
Chapter 5 Printed Tracks for Smart Tags and Packaging
Chapter 6 Printed Optoelectronic Devices and Energy Suppliers for Smart Packaging
Chapter 7 Printed Sensors and Indicators
Chapter 8 Integrated Printed Electronics Systems
Chapter 9 Outlooks and Perspectives