This textbook provides readers with a comprehensive introduction to various noise sources that significantly reduce performance and reliability in nanometer-scale integrated circuits. The author covers different types of noise, such as crosstalk noise caused by signal switching of adjacent wires, power supply noise or IR voltage drop in the power line due to simultaneous buffer / gate switching events, substrate coupling noise, radiation-induced transients, thermally induced noise and noise due to process and environmental Coverages also includes the relationship between some of these noise sources, as well as compound effects, and modeling and mitigation of noise mechanisms.

Offers comprehensive, textbook coverage of all major noise mechanisms affecting nanometer VLSI circuits Covers power supply noise in on-chip power and ground distribution networks and its impact on circuit performance Highlights impact of noise on chip timing and functionality and on clock networks

Autorentext

Selahattin Sayil received the M.Sc. degree from the Pennsylvania State University, University Park, PA, in 1996 and the Ph.D. degree in Electrical Engineering from Vanderbilt University, TN, in 2000. He is currently a Professor and Distinguished Faculty Fellow in Electrical Engineering at Lamar University, where he leads the VLSI CAD and Signal Integrity Group. His current research interests include mitigation of radiation effects in VLSI, interconnect delay and noise analysis, low-power design and testing. His teaching interests include online teaching, high-impact online labs and virtual team learning. He has authored two books, two book chapters and published near thirty refereed journal articles that include special feature articles, and presented at many international conferences. He is a member of IEEE and serves as an Associate Editor for International Journal of Electronics.

Inhalt

Introduction.- Interconnect Noise.- Clock Noise and Uncertainty.- Power Supply Noise.- Substrate Coupling Noise.- Radiation Induced Soft Error Mechanisms.- Thermally Induced Errors.- Impact of Process Variations.