This book discusses the complex technology of building CMOS computer chips and covers some of the unusual problems that can occur during chip manufacturing. Readers will learn how plasma and process damage results from the high-energy processes that are used in chip manufacturing, causing harm to the chips, functional failure and reliability problems.

Provides an up-to-date, single-source reference on CMOS plasma and process damage, for engineers from all disciplines Offers concise, comprehensive coverage, discussing real problems with necessary background for working engineers Applies to design, layout, mask making, lithography, process and device engineering, testing and reliability

Autorentext

Kirk D. Prall (M'82) was born in 1958. He received the Ph.D. degree in electrical engineering from the University of New Mexico, Albuquerque, in 1990. He worked for Philips Semiconductors from 1982 to 1991, in the areas of EPROM, ROM, microprocessors. He joined Micron, Inc., Boise, ID, in 1991 working on DRAM, NOR, NAND, and emerging memories. He retired from Micron in 2019 and is currently writing engineering books. He has published several papers and holds more than 200 patents.

Inhalt

Chapter 1. BACKGROUND.- Chapter 2. THE ANTENNA EFFECT.- Chapter 3. DIODE AND TRANSISTOR PROTECTION.- Chapter 4. SIGNATURES OF PROCESS DAMAGE.- Chapter 5. ELECTRICAL SIGNATURES OF PROCESS DAMAGE.- Chapter 6. LATENT DAMAGE AND RELIABILITY DEGRADATION.- Chapter 7. ATOMIC-LEVEL DEFECTS AND ELECTRICAL EFFECTS.- Chapter 8. TECHNOLOGY SPECIFIC PROCESS DAMAGE.- Chapter 9. COMMON SOURCES OF PROCESS DAMAGE.- Chapter 10. INLINE PROCESS DAMAGE MEASUREMENTS.- Chapter 11. PROCESS DAMAGE TEST STRUCTURES.- Chapter 12. DESIGN RULES RELATED TO PROCESS DAMAGE .- Chapter 13. PARAMETRIC DAMAGE TESTING STRATEGY AND PROCEDURES.- Chapter 14. THE ROLE OF HYDROGEN.- Chapter 15. METALLIC DEFECTS.- Chapter 16. MOBILE ION CONTAMINATION.- Chapter 17. FIXED CHARGE.