This book illustrates a variety of circuit designs on plastic foils and provides all the information needed to undertake successful designs in large-area electronics. The authors demonstrate architectural, circuit, layout, and device solutions and explain the reasons and the creative process behind each. Readers will learn how to keep under control large-area technologies and achieve robust, reliable circuit designs that can face the challenges imposed by low-cost low-temperature high-throughput manufacturing.

Discusses implications of problems associated with large-area electronics and compares them to standard silicon Provides the basis for understanding physics and modeling of disordered material Includes guidelines to quickly setup the basic CAD tools enabling efficient and reliable designs Illustrates practical solutions to cope with hard/soft faults, variability, mismatch, aging and bias stress at architecture, circuit, layout, and device levels Includes supplementary material: sn.pub/extras

Inhalt

Introduction.- Applications of large-area electronics on foils.- State of the art in circuit design.- Device modeling and characterization.- Sensor frontend architecture.- Circuit design for analog signal conditioning.- Circuit design for data conversion.- Circuit design for digital processing.- Conclusions.