This book discusses in detail the fundamental principles and design specifications governing fully-integrated temperature sensors in deep-submicron CMOS technology. It provides an in-depth analysis of diverse sensing and readout circuit architectures, cutting-edge ultra-low-voltage and frequency-locked loop (FLL) design methodologies, and detailed implementation strategies. Readers will gain valuable insights from the latest advancements in deep-submicron CMOS technology, mastering a range of precision-driven, area- and energy-efficient techniques. This knowledge empowers readers to identify and develop optimal architectures tailored to specific applications and technology nodes. Moreover, the book serves as an invaluable resource for professionals in circuit and system design, particularly those focused on temperature sensing systems or high-performance integrated circuits, offering practical guidance for researchers and engineers in both academia and industry.

Discusses the principles and design specifications of fully-integrated temperature sensors in deep-submicron CMOS Describes temperature sensor architectures in the CMOS process, in terms of application and technology downscaling Details implementations of high-performance temperature sensors based on deep-submicron processes

Autorentext

Dan Shi received the B.Sc. and M.Sc. degree in microelectronics from Sichuan University, Chengdu, China, in 2016 and 2019, respectively. And, she received the Ph.D. degree in electrical and computer engineering (ECE) at University of Macau, Macau, China in 2025. She served as an Associate Professor at Guangdong University of Technology since 2025. She worked as an analog circuits design engineer at IC company for two years from 2019 to 2021, where she was involved in high-speed clock, I/O interface, analog driven-circuit designs. Her current research focuses on the design of low-voltage and energy-efficient smart temperature sensors.

Dr. Shi has published prestigious IEEE journals and conferences, including International Solid-State Circuits Conference (ISSCC), Journal of Solid-State Circuits (JSSC), Transactions on Circuits and Systems I (TCAS-I), Transactions on Circuits and Systems II (TCAS-II), and International Conference on Integrated Circuits, Technologies and Applications (ICTA). She was a recipient of the student travel grant award (STGA) in 2025 ISSCC.

Rui P. Martins received the Ph.D. in Electrical Engineering and Computers from the Department of Electrical and Computer Engineering, Instituto Superior Técnico, University of Lisbon, Portugal, in 1992, and has been with that Department since October 1980. From 1992, he has been on leave from University of Lisbon and with the Department of Electrical and Computer Engineering, Faculty of Science and Technology, University of Macau, Macao, China, where he is a Chair-Professor since Aug. 2013. His research interests are on analog and mixed-signal VLSI design and has authored or co-authored 900+ publications, including 10 books, 12 book chapters, 50 Patents, 300+ papers in scientific journals and 400+ in conference proceedings. He was the Founding Director of the St

Inhalt

Introduction.- State-of-the-Art Resistor-Based Temperature Sensors Topology.- ULV and ULP Temperature Sensor for IoT-Driven.- Wire-Metal-Based Temperature Sensor for Technology-Scaling.-Conclusion and Outlook.