This fifth part in a collection presenting industrial problems to mathematicians. Developed from the cooperation between mathematicians and industrial scientists on the "grass roots" level of specific problems. Through the author, scientists working in industry pose current industrial problems to mathematicians for solution and/or mathematical formulation.

Autorentext

Anver Friedman is a Distinguished University Professor. He received his PH.D. degree in 1956 from the Hebrew University. His research interests include partial differential equations, both general mathematical theory as well as applications to models that arise in the physical and life sciences, in engineering, and in industry. Chiu-Yen Kao is an Associate Professor at Claremont McKenna College. Her area of expertise is in applied mathematics.

Inhalt
1 Sparse matrix methods for chemical process simulation.- 1.1 Chemical process engineering.- 1.2 Equation based approach to process simulation.- 1.3 The frontal method.- 1.4 References.- 2 High speed coating of optical fibers.- 2.1 Optical fiber manufacturing.- 2.2 Coating of optical fiber.- 2.3 The upper meniscus.- 2.4 An ideal fluid model.- 2.5 References.- 3 Imaging by random coverage.- 3.1 The film.- 3.2 Transmittance and granularity.- 3.3 Moments of the transmission.- 3.4 Photographic granularity.- 3.5 References.- 4 Stress-assisted diffusion in glassy polymers.- 4.1 Diffusion in polymers.- 4.2 Previous models of Non-Fickian diffusion.- 4.3 New formulation.- 4.4 Open problems.- 4.5 References.- 5 Kinetic swelling of crosslinked polymer.- 5.1 The one-dimensional model.- 5.2 Three dimensions: spherical symmetry.- 5.3 The swelling process in general geometry.- 5.4 Solution to problems (1) (2).- 5.5 References.- 6 Stochastic analysis of a slotted communication channel.- 6.1 Slotted channel.- 6.2 Mathematical model.- 6.3 Mathematical results.- 6.4 Open problems.- 6.5 References.- 7 Mathematical problems in color visualization.- 7.1 Areas of applications.- 7.2 Methods of imaging.- 7.3 Characterization of the media.- 7.4 Image processing analysis.- 7.5 Problem areas.- 7.6 References.- 8 Simulated annealing in protein folding.- 8.1 The problem.- 8.2 Numerical approach.- 8.3 Results.- 8.4 Open questions.- 8.5 References.- 9 Ideal forming theory.- 9.1 Rigid-perfectly plastic flow.- 9.2 2-dimensional steady flow.- 9.3 Generalization to 3-dimensions.- 9.4 Mathematical issues.- 9.5 References.- 10 Predicting properties of composite materials.- 10.1 Elastic moduli of a composite.- 10.2 The HashinStrikman bounds.- 10.3 Third-order bounds.- 10.4 Homogenization.- 10.5Simulation.- 10.6 Open problems.- 10.7 References.- 11 Interprocessor memory contention.- 11.1 Simulation.- 11.2 Dimensional analysis.- 11.3 Results.- 11.4 Open problems.- 11.5 References.- 12 Computation of volume integrals in potential theory.- 12.1 The general method.- 12.2 Computing boundary and volume integrals.- 12.3 Extensions and open problems.- 12.4 References.- 13 Mathematics of blood analysis.- 13.1 Competitive immuno-assay.- 13.2 Equilibrium and the dose-response curve.- 13.3 The kinetic problem.- 13.4 Liapunov functions for (13.15).- 13.5 References.- 14 Averaged equations for layered and blocky media.- 14.1 Quasistatic equations.- 14.2 The one-cell problem.- 14.3 Discrete contact problem.- 14.4 Application to the unit cell problem.- 14.5 References.- 15 Brownian dynamics simulations of colloidal dispersion.- 15.1 Viscosity divergence.- 15.2 Brownian Dynamics.- 15.3 Simulation.- 15.4 Future directions.- 15.5 References.- 16 Kinetic models of photobleaching.- 16.1 Photobleaching.- 16.2 The kinetic model.- 16.3 Travelling wave solution.- 16.4 Open problems and solution.- 16.5 References.- 17 Micromagnetics.- 17.1 Domains and walls.- 17.2 Equilibrium.- 17.3 The time-dependent problem.- 17.4 Domain-wall calculations.- 17.5 Open problems.- 17.6 References.- 18 A Bayesian framework for computer vision.- 18.1 The Markov random field approach.- 18.2 The mean field approach.- 18.3 Saddle point approximation.- 18.4 Renormalization group technique.- 18.5 References.- 19 Stress from trenches in semiconductor devices.- 19.1 Stress and performance.- 19.2 Stress caused by trench spacing.- 19.3 References.- 20 Solutions to problems from parts 24.- 20.1 Part 4.- 20.2 Part 3.- 20.3 Part 2.- 20.4 References.