Experimental Methods: Whole-field displacement measurement with Moiré interferometry as a basis for a microstructural Fe model of a polymer bonded explosive; H.T. Goldrein, et al. Measurement of microscopic residual stress based on the evolution of surface roughness during shallow chemical etching; Kyung-Suk Kim. The incubation of time theory and experiment; N.F. Morzov, Y.V. Petrov. Affordable TMF testing supported by Fe Simulation; M. Hasselqvist. Identification of dynamic properties of railway track; V.L. Markine, et al. Optical method to study material behaviour at high strain rates; J. Kajberg, M. Sjödahl. Determination of cylindrical elastic orthotropy in wood by digital speckle photography; L.O. Jernkvist, F. Thuvander. Optimization Techniques and Simulation Methods: Identification of elastic/visco-plastic material constants under impact loading; S. Aoki, et al. Parameter identification for inverse problems in metal forming simulations; J.P. Ponthot, et al. One step prediction error approach to the identification problem of creep and viscoplastic material models; O. Wall, J. Holst. Automated identification and calculation of the parameters of non-linear material models; R. Mohrmann. Inversion method using spectral decomposition of Green's functions; M. Hori. Determination of ballast parameters of railway track using an optimisation technique; V.L. Markine, C. Esveld. Estimation of material parameters at elevated temperatures by inverse modelling of a Gleeble experiment; M. Eriksson, et al. Material Modeling: Hybride-induced embrittlement in metals-stress and temperature effects; A.G. Varias, A.R. Massih. A non-isothermal model for the phase transformations and the mechanicalbehaviour of a 12% chromium steel; R. Mohrmann. Size-effect on stress intensity factors of CNS specimen with an interface crack subjected to mixed-mode loading; K. Machida. On pennyshaped equilibrium cracks in materials reinforced by fibers; M.A. Grekov, et al. Identification of stress from strain for body with not fully identified constitutive relations; M. Hori, T. Kameda. Evaluation method of interface strength between thin films in LSI; T. Kitamura, et al. List of Authors.