The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.

This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed.

Presents the technological advancement of shifting Photonic Integrated Circuits (PICs) from 2D to 3D configuration Explains the basics and key components of PICs, and compares photonic and electronic circuits Describes the design and fabrication techniques of 3D PICs and related challenges and solutions

Autorentext

Dr. Yi is currently Fellow of Optica (Optical Society of America), a full Professor of Electrical Engineering, was the founding EECE PhD program chair and Provost faculty fellow, University of Michigan, Dearborn campus, and LNF, University of Michigan, Ann Arbor campus. He received the Ph.D. degree from the Massachusetts Institute of Technology (MIT), Cambridge, MA, USA, and was a Post-Doctoral Associate with the MicroPhotonics Center, Massachusetts Institute of Technology, Cambridge, MA, USA, where he was involved in research on integrated nano optoelectronic devices and systems. He had extensive research experiences with the Los Alamos National Laboratory, and the 3M Corporate Research Laboratory. He is also a Professor Affiliate with the Microsystems Technology Laboratory at MIT. He has authored more than hundreds of top journal papers, edited four book/book chapters, and holds 33 issued patents (17 U.S. patents and 16 international patents). He has led several government/industry-funded projects, has been at review panels for NSF, DOE and DOD, and has been a reviewer for leading journals. His research interests are Integrated/Intelligent chips, Renewable energy, Smart micro sensors; Virtual Reality/Augmented Reality, Solid state on-chip Lidar for autonomous driving/UAVs/Robotics; Telecommunications; and Solid state lighting.

Inhalt

Introduction to 3D Photonics.- Fundamentals of Photonic Integrated Circuits.- The Evolution from 2D to 3D PICs.- Design and Fabrication Techniques.- Thermal Management in 3D PICs.- Alignment and Packaging of 3D PICs.- Heterogeneous and Hybrid Integration.- Applications of 3D Photonics.- Modeling and Simulation Tools.- Industry Trends and Future Directions.- Case Studies and Real-World .- Applications.- Conclusion and Vision for the Future.- References and Further Reading.- Appendix.