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Thermal Transport in Oblique Finned Micro/Minichannels

  • Kartonierter Einband
  • 130 Seiten
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The main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation t... Weiterlesen
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Beschreibung

The main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation technique for single-phase micro/minichannel heat sink. The specific objectives of the volume are to: Introduce a novel planar oblique fin microchannel and cylindrical oblique fin minichannel heat sink design using passive heat transfer enhancement techniques Investigate the thermal transport in both planar and cylindrical oblique fin structures through numerical simulation and systematic experimental studies.
Evaluate the feasibility of employing the proposed solution in cooling non-uniform heat fluxes and hotspot suppression Conduct the similarity analysis and parametric study to obtain empirical correlations to evaluate the total heat transfer rate of the oblique fin heat sink Investigate the flow mechanism and optimize the dimensions of cylindrical oblique fin heat sink Investigate the influence of edge effect on flow and temperature uniformity in these oblique fin channels.

Proposes a novel passive heat transfer enhancement technique

Explains unique feature of oblique finned micro/minichannel: higher heat transfer enhancement with negligible pressure drop, as distinguished from conventional heat transfer enhancement techniques that impose increased pressure drop penalty

Provides detailed theoretical analysis, numerical and experimental studies for oblique finned micro/minichannel

Includes supplementary material: sn.pub/extras



Inhalt
Introduction.- Planar Oblique Fin Microchannel Heat Sink.- Cylindrical Oblique Fin Minichannel Heat Sink.- Thermal Management and Application for Oblique Fins.- Conclusions.- Appendix.- References.

Produktinformationen

Titel: Thermal Transport in Oblique Finned Micro/Minichannels
Autor:
Schöpfer:
EAN: 9783319096469
ISBN: 978-3-319-09646-9
Format: Kartonierter Einband
Herausgeber: Springer, Berlin
Genre: Technik
Anzahl Seiten: 130
Größe: H7mm x B234mm x T160mm
Jahr: 2014
Untertitel: Englisch
Auflage: 2015

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