MEMS and Nanotechnology , Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics , the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:

Microelectronics Packaging

Single Atom/Molecule Mechanical Testing

MEMS Devices & Fabrication

In-Situ Mechanical Testing

Nanoindentation

Experimental Analysis of Low-Dimensional Materials for Nanotechnology

Includes supplementary material: sn.pub/extras

Klappentext

MEMS and Nanotechnology*, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics* , the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:

Microelectronics Packaging

Single Atom/Molecule Mechanical Testing

MEMS Devices & Fabrication

In-Situ Mechanical Testing

Nanoindentation

Experimental Analysis of Low-Dimensional Materials for Nanotechnology

Inhalt
From the Contents: Warpage Measurement of Simulated Electronic Packaging Assembly.- Nanomechanical Characterization of Lead Free Solder Joints.- In-Situ Surface Mount Process Characterization Using Digital Image Correlation.- Acoustic Waveform Energy as an Interconnect Damage Indicator.- Shape Optimization of Cantilevered Piezoelectric Devices.- Unique Fabrication Method for Novel MEMS Micro-contact Structure.- A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms.- Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics.