This book provides a comprehensive overview of the recent developments in advanced packaging. Established techniques are discussed, as well as emerging technologies, in order to provide readers with the most up-to-date developments.

Klappentext

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Inhalt

Materials for 3D Packages.- Materials for Advanced Bonding/ Joining Techniques.- Materials for Advanced Interconnections.- Lead-Free Solders.- Materials for Wafer Processing (such as thinning).- Materials for Advanced Substrates (such as thin core or coreless substrates).- Materials for Advanced Underfill and Encapsulant.- Adhesives (ECA, Nano-ECA, Die Attach Adhesive).- Advanced Thermal Interface Materials.- Materials for Embedded Passives.- Nanomaterials/ Nanopackaging.- Wafer Level Packaging.- MEMS Packaging.- Optical Packaging.- Digital Health and Biomedical Packaging.