Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.

Inhalt

Preface. Technology of Multichip Modules. 3-D Interconnection Microsystems Applications; C. Val. High Performance Packaging with Multilayer Ceramic Modules; E. Bihler. High Frequency LTCC Modules, P. Johnsson, C. Vaktnäs, N. Billström. Analysis and Optimization of Circuit Interconnect Performance; J. Peeters, E. Beyne. High Performance Interconnect on Cofired Ceramic; K. Kurzweil, D. Lambert. New Aspects in the Reliability Design of High Density Interconnects in MCMs; G. Harsányi. MCM-D Technology with Active and Passive Substrates; H. Hentzell. High Performance Ceramic Modules and Packages; P. Danner. Laser Processing in MCM-C Technologies; Z. Illyefalvi-Vitéz. LTCC Technology: Where we Are and Where we're Going; C.Q. Scrantom. Design and Realization of High Performance Ceramic Heat Sinks; E. Gambarte, M. Töpfer, A. Paredes, M. Reill, M. Weichmann. A1N Cofired MCM-C/D; W.K. Jones, M.A. Zampino. Very Fine Line Photoimageable Thick Film Technology Developed at Hybridas, Lithuania; J. Minalgiene, S. Muckett. Applications of MCM-C or Mixed MCM Technologies. High-Performance Solid State Mass Memory Modules; A. Coello-Vera, P. d'Andrea. Mass Memory Packaging for Space Applications; J. de Givry. Advanced Multichip Modules for Telecom Applications; K. Lösch, H.M. Rappold. Telecom Applications of MCM Technology; J.L. Conesa. Design and Realization of a Multichip Module as a Motion Estimator for HDTV-Applications; S. Fazelpour, R. Brodowski, R. Dümcke, H. Reichl, B. Bölike. Multi-Chip Module Applications in Satellite Communications; N. Sinnadurai. Material for MCM Applications. Materials/Design Considerations for MCMs; H.K. CharlesJr. MCMs: Material Choices for Electronics and Optoelectronics; N. Chandler, N.E. Sellars, R.K. Barton, S.J. Foster, P.D. Sleep, G.N. Blackie, I.R. Croston. Low Permittivity Porous Silica Thin Films for MCM-C/D Applications; R.A. Gerhardt, J.R. Kokan, P.A. Kohl. MCM Passivation Studies for Enhanced Producibility and Reliability; T.J. Sanders, C.R. Miller, K.E. Gsteiger, G.T. Hess, D. Nedunchellyan. Buried Thick Film Capacitors Built up with High-K Dielectrics for MCM-Applications; W. Smetana. Sensors Technology for MCM-C Technologies. Advances in Materials for Sensors; S. Mergui. PTC Thick Film Thermistors; J. Hormadaly, S.J. Horowitz, J.R. Larry, P. O'Callaghan. Evaluation of Some Thick Film Materials for Temperature, Force, and Humidity Sensors; M. Hrovat, D. Belavič, J. Holc. Parameters and Technology of Thick Film Electrolytic SO2 Sensors; L.J. Golonka. Sensors: a Great Chance for Microelectronic Technologies; R. dell'Acqua. High Sensitivity Thermometers for Millikelvin Temperature Range; M. Somora, D. Vanický, I. Baťka, K. Flachbart. Thick Films Based on Glass and Polymeric Matrices, Mechanism of Conductivity; I. Křivka, J. Kubát, R. Kužel, J. Prokeš. Author Index. Keyword Index.