Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. It discusses established techniques, as well as emerging technologies such as digital health, bio-medical, and nano-materials/processing, in addition to microelectronic and optoelectronic packaging. The book therefore provides readers with the most up-to-date developments in advanced packaging.

Inhalt
3D Integration Technologies An Overview.- Advanced Bonding/Joining Techniques.- Advanced Chip-to-Substrate Connections.- Advanced Wire Bonding Technology: Materials, Methods, and Testing.- Lead-Free Soldering.- Thin Die Production.- Advanced Substrates: A Materials and Processing Perspective.- Advanced Print Circuit Board Materials.- Flip-Chip Underfill: Materials, Process and Reliability.- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips.- Electrically Conductive Adhesives (ECAs).- Die Attach Adhesives and Films.- Thermal Interface Materials.- Embedded Passives.- Nanomaterials and Nanopackaging.- Wafer Level Chip Scale Packaging.- Microelectromechanical Systems and Packaging.- LED and Optical Device Packaging and Materials.- Digital Health and Bio-Medical Packaging.