Chemical Mechanical Planarization (CMP) is fast becoming the established technology for removing unwanted materials after etching from the semiconductor chip surface, as well as for other steps in the manufacturing process. This volume is a comprehensive review of CMP technology in state-of-the-art semiconductor manufacturing. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered, as are polishing tools and consumables. The leading edge issues of damascene and new dielectrics as well as slurryless technology are also developed.

Klappentext

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Inhalt

1 Introduction.- 2 CMP Technology.- 3 Metal Polishing Processes.- 4 Metal CMP Science.- 5 Equipment Used in CMP Processes.- 6 CMP Polishing Pads.- 7 Fundamentals of CMP Slurry.- 8 CMP Cleaning.- 9 Patterned Wafer Effects.- 10 Integration Issues of CMP.- Appendix: Pourbaix Diagrams.- References.