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Cook Over IP

  • Kartonierter Einband
  • 92 Seiten
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This book focuses on enabling internet connectivity to cordless kitchen appliances. It introduces the Ki Cordless Kitchen standard... Weiterlesen
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Beschreibung

This book focuses on enabling internet connectivity to cordless kitchen appliances. It introduces the Ki Cordless Kitchen standard, describes the possible architectures to enable internet connectivity and dives deep into addressing the networking challenges.

Today many kitchen appliances are being connected to the internet to facilitate smart cooking. The Wireless Power Consortium is working on the Ki Cordless Kitchen standard to make wirelessly powered cordless appliances a reality. In Ki, the cordless appliances are powered by inductive power sources integrated into the kitchen countertops. The cordless appliance and the power transmitter exchange data using a time-slotted NFC channel.

The book describes architectures and solutions using lightweight TCP/IP stacks to optimise and seamlessly adapt TCP to the time-slotted, low data rate NFC channel, and thereby enable a truly IoT-based cooking experience for cordless kitchens.



Explains the cordless kitchen and explain the challenges to its implementation

Includes practical information from research into real appliances from Philips in the Netherlands

Of interest to companies, developers and researchers



Inhalt
Chapter 1. Introduction.- Chapter 2. Ki - The Cordless Kitchen.- Chapter 3. Architectures for Internet Connectivity.- Chapter 4. State of the art.- Chapter 5. Adapting TCP for the Bridge Architecture.- Chapter 6. Evaluation of the Bridge Architecture.- Chapter 7. Parametric Analysis of the Bridge Architecture.- Chapter 8. Conclusion.

Produktinformationen

Titel: Cook Over IP
Untertitel: Cordless Smart Kitchen Appliance Architectures and Protocols
Autor:
EAN: 9783030858353
ISBN: 3030858359
Format: Kartonierter Einband
Herausgeber: Springer International Publishing
Genre: Elektrotechnik
Anzahl Seiten: 92
Gewicht: 154g
Größe: H235mm x B155mm x T5mm
Jahr: 2021
Untertitel: Englisch
Auflage: 1st ed. 2021

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