This book gathers selected papers presented at the 1st International Conference on Industrial Applications of Adhesives 2020 (IAA 2020). It covers a wide range of topics, including adhesive curing for electronic and automotive industries; adhesive testing with a torsion machine for rigorous mechanical properties determination; joint design using innovative techniques such as the meshless method; design methodologies in the automotive industry for joints under impact; temperature effects in joints typically found in civil engineering; and advanced nondestructive techniques such as terahertz spectroscopy to assess the durability of adhesive joints. Providing a review of the state-of the art in industrial applications of adhesives, the book serves as a valuable reference resource for researchers and graduate students interested in adhesive bonding.

Presents the proceedings of the 1st International Conference on Industrial Applications of Adhesive, held in Funchal, Madeira Covers a wide range of topics relating to adhesive curing for electronic and automotive industries Serves as a reference resource for researchers and graduate students interested in adhesive bonding

Inhalt
Novel torsion machine to test adhesive joints.- Ageing condition determination of bonded joints by terahertz spectroscopy.- Analysis of Temperature Effect on Deformation Behaviour and Bond Strength of Adhesive Joints with Steel and Composite Substrates.- Some Industrial Examples of Accelerated Curing Using Curie Particles.- Use of UV-curing adhesive systems on non-transparent joining parts by using sidelight activated polymer optical fibres.- Techniques for the mechanical characterization and numerical modelling of bonded automotive structures under impact loads.