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Semiconductor Process Reliability in Practice

  • E-Book (epub)
  • 528 Seiten
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Proven processes for ensuring semiconductor device reliabilityCo-written by experts in the field, Semiconductor Process Reliabilit... Weiterlesen
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Beschreibung

Proven processes for ensuring semiconductor device reliabilityCo-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.Coverage includes:Basic device physicsProcess flow for MOS manufacturingMeasurements useful for device reliability characterizationHot carrier injectionGate-oxide integrity (GOI) and time-dependentdielectric breakdown (TDDB)Negative bias temperature instabilityPlasma-induced damageElectrostatic discharge protection of integrated circuitsElectromigrationStress migrationIntermetal dielectric breakdown

Zusammenfassung
Proven processes for ensuring semiconductor device reliability Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide. Coverage includes: Basic device physics Process flow for MOS manufacturing Measurements useful for device reliability characterization Hot carrier injection Gate-oxide integrity (GOI) and time-dependent dielectric breakdown (TDDB) Negative bias temperature instability Plasma-induced damage Electrostatic discharge protection of integrated circuits Electromigration Stress migration Intermetal dielectric breakdown

Produktinformationen

Titel: Semiconductor Process Reliability in Practice
Autor:
EAN: 9780071754286
ISBN: 978-0-07-175428-6
Digitaler Kopierschutz: Adobe-DRM
Format: E-Book (epub)
Herausgeber: Mcgraw-Hill Education
Genre: Elektronik, Elektrotechnik, Nachrichtentechnik
Anzahl Seiten: 528
Veröffentlichung: 04.10.2012
Jahr: 2012
Untertitel: Englisch