Analytical Techniques for Thin Films

Treatise on Materials Science and Technology, Volume 27: Analytical Techniques for Thin Films covers a set of analytical techniques developed for thin films and interfaces, all based on scattering and excitation phenomena and theories. The book discusses photon beam and X-ray techniques; electron beam techniques; and ion beam techniques. Materials scientists, materials engineers, chemical engineers, and physicists will find the book invaluable.

Inhalt

Contributors
Preface
Part I. Introduction
1 Submicron Structure and Microanalysis
I. Introduction
II. Submicron Structure
III. Microanalysis
IV. Chapter Synopses
Part II. Photon Beam and X-Ray Techniques
2 Synchronotron Radiation Photoemission Studies of Interfaces
I. Statement of Purpose
II. Introduction
III. Synchronotron Radiation Photoemission
IV. Case Studies
V. Concluding Remarks
Notes
3 Esca
I. Introduction
II. Instrumentation and Experimental Considerations
III. Surface Sensitivity
IV. Quantitative Analysis
V. Depth Profiling
VI. Chemical Shifts and Solid State Screening
VII. Surface and Interface Segregation
VIII. Line Widths and Line Shapes
IX. Auger Spectra
X. Valence Electron Spectra
Summary
References
4 Modern Developments in Soft X-Ray Imaging
I. Introduction
II. Soft X-Ray Sources
III. Resolution
IV. Potential Applications in Materials Science
References
5 X-Ray Diffraction Analysis of Strains and Stresses in Thin Films
I. Introduction
II. Strain-Stress Relations
III. X-Ray Diffraction Techniques
IV. Summary
Appendix A. Tensor Transformations and Matrix Notation
Appendix B. Relations between Stiffnesses and Compliances
References
6 X-Ray Diffraction Analysis of Diffusion in Thin Films
I. Introduction
II. Diffusion Equations
III. X-Ray Diffraction Analysis
IV. Summary
References
Part III. Electron Beam Techniques
7 Cross-Sectional Transmission Electron Microscopy of Electronic and Photonic Devices
I. Epoxy-Embedding Technique
II. TEM Cross Section Sample Preparation Technique for III-V Compound Semiconductor Device Materials by Chemical Thinning
III. Pre-ion-Milling Etch and Pre-ion-Milling Drill Techniques
IV. Glass Sealing Cross-Section TEM Sample Preparation
V. Feature Enhancement
VI. TEM Test Pattern
VII. Future Trends and Summary
References
8 High-Resolution Transmission Electron Microscopy of Surfaces and Interfaces
I. Introduction
II. Lattice Imaging
III. Diffraction Contrast Techniques
IV. Surfaces
V. Current Developments
References
9 Scanning Transmission Electron Microscopy
I. Introduction
II. Stem Electron Optics
III. Common Analytical Techniques
IV. Energy-Filtered Imaging
V. High-Resolution Energy-Loss Studies
VI. Property-Dependent Techniques
VII. Computer Interaction with the Stem
VIII. Conclusions
References
Part IV. Ion Beam Techniques
10 Rutherford Backscattering Spectrometry on Thin Solid Films
I.Introduction
II.Basic Concepts of Rutherford Backscattering Spectrometry
III.Elemental Composition and Depth Profiling: Applications and Examples
IV.Microbeam Applications
V.Concepts of Channeling
VI.Epitaxial Thin-Film Applications
VII.Superlattices
VIII.Surface-Structure Studies
References
11 The Atomic Structure and Atomic Layer Compositional Analysis of Thin Solid Films Using the Time-of-Flight Atom-probe Field Ion Microscopy
I.Introduction
II.Method of Absolute Composition Depth Profiling in the Atom-probe
III.Instrumentation
IV.Applications to Surface-layer Analysis
V.Concluding Remarks
References
Index